Tin Plated Cuprum Foil
Product Introduction
Aeris producta exposita in aere prona suntoxidatioet formatio carbonas aeris fundamentalis, quae alte resistit, pauperum electricae conductivity et potentiae transmissionis amissio alta est; Post stannum laminam, producti aeris tin dioxidum membranae in aere formant ob proprietates ipsius metalli stagni ulterius oxidationis prohibendi.
Basis Material
●Summus praecisio Rolled Copper Foil, Cu(JIS: C1100/ASTM: C11000) contenta plus quam 99,96%
Basis Material Crassitudo dolor
●0.035mm~0.15mm (0.0013 ~0.0059inches)
Base Material Latitudo Range
●≤300mm (≤11.8 inches)
Basis Material Temperies
●Secundum elit elit
Applicationem
●Adjumenta electrica et electronica industria, civilia (ut: potum sarcinarum et instrumentorum contactuum cibi);
Morbi laoreet euismod
| Items | Weldable plumbum Plating | Non plumbum plumbum Plating |
| Latitudo dolor | ≤600mm (≤23.62inches) | |
| Crassitudo dolor | 0.012~0.15mm (0.00047inches~0.0059inches) | |
| Tin accumsan Crassitudo | ≥0.3µm | ≥0.2µm |
| Tin Content of plumbum lamina | LXV ~ XCII% (potest accommodare stagni content secundum elit welding process) | 100% Pure Tin |
| Superficies resistentia plumbi(Ω) | 0.3~0.5 | 0.1~0.15 |
| Adhaesio | 5B | |
| Distrahens fortitudo | Basis Material euismod Attenuatio post Plating ≤10% | |
| Prolongatio | Basis Material euismod Attenuatio post Plating ≤6% | |
