2L flexibilia aeris Laminate
2L flexibilia aeris Laminate
Cngen Metal scriptor Duo-Layer FCCL offert High conductivity, optimum scelerisque stabilitatem, et diuturnitatem, maintaining firmum perficientur etiam in altus-temperatus et dura ambitus. Praeterea, in materia est praestantes flexibilitate et processability, faciens idoneam complexu circuitu consilia. Et compositum ex summus qualitas aeris et polyimide film ensures superior electrica perficientur et certa diu terminus usum.
Cubits
| Product Name | Cu FORUM Type | Structura |
| Mg2db1003eh | ED | 1/3 Oz cu | 1.0mil TPI | 1/3 Oz Cu |
| Mg2db1005eh | ED | 1/2 Oz cu | 1.0mil TPI | 1/2 Oz Cu |
| Mg2df0803er | ED | 1/3 Oz cu | 0.8mil TPI | 1/3 Oz Cu |
| Mg2df1003er | ED | 1/3 Oz cu | 1.0mil TPI | 1/3 Oz Cu |
| Mg2df1005er | ED | 1/2 Oz cu | 1.0mil TPI | 1/2 Oz Cu |
| Mg2df1003rf | RA | 1/3 Oz cu | 1.0mil TPI | 1/3 Oz Cu |
| Mg2df1005rf | RA | 1/2 Oz cu | 1.0mil TPI | 1/2 Oz Cu |
Productum perficientur
Tenuis et lightweightEt II-layer FCCL est pacto et lightweight, faciens ideale pro electronic cogitationes ubi spatium-salute et pondus reductionem sunt discrimine.
Mollitia: Non est optimum flexibilitate, capaces impedientem multiple flectit et caulas sine comproming perficientur, faciens idoneam ad electronic products cum complexu figuris et mobilia.
Superior electrica perficientur: II-layer FCCL features a humilis dielectric constans (DK), quae facilitates summus celeritate signum tradenda, reducendo signum mora et damnum, faciens perfectam ad altum frequency applications.
Scelerisque stabilitatemEt materia est praestantes scelerisque conductivity, permittens efficens calor dissipatio et ensuring firmum operationem components sub altum temperatus conditionibus.
Calor resistentia: Cum a summo speculo transitus temperatus (TG), II-layer FCCL maintains bonum mechanica et electrica proprietatibus etiam in summus temperatus environments, faciens idoneam ad electronic products usus est in tali condiciones.
Reliability et diuturnitatem: Ob suam firmum eget et physica proprietatibus, II-layer FCCL maintains eius perficientur per diuturnos, providing certa diu terminus usus.
Idoneam ad automated productio: Quia II-layer FCCL plerumque suppleverunt in volumine forma, quod facilitatem automated et continua productio in vestibulum, enhancing productio efficientiam et reducing costs.
Product Application
Rigidum-flex PCBs: II-accumsan FCCL late usus est in armorum officinis rigida-flex PCBBs, quod miscere flexibilitatem flexibilia circuitus cum mechanica vires rigida PCBS, idoneam ad compacta consilia in complexu electronic cogitationes.
Chip in film (cof): II-layer FCCL adhibetur in chip packaging technology directe in film, communiter applicantur in propono, camera modules, et alia spatia constrained applications.
Flexibile typis Circuit Boards (FPCs): II-layer FCCL saepe in productione flexibile typis circuitu tabulas, quae late applicantur in mobile cogitationes, wearable technology, et medicinae apparatu ubi leve et flexibilitate sunt requiritur.
High frequentiam communicationis cogitationes: Ob suam humilitatem dielectric constans et excellens electrica proprietates, II-accumsan FCCL adhibetur in armorum officinis antennas et alia clavis components in altus-frequency communicationis cogitationes.
Electronics Books: In Books electronic systems, II-layer FCCL adhibetur ad coniungere complex electronic modules, praesertim in environments in quo flexibile hospites et summus temperatus resistentia.
Haec applicationem locis highlight in extensive usus et momenti II-layer FCCL in modern electronic products.
